Syncro’s board-level assembly capabilities include thick film fabrication and hybrid assembly. This assembly process supports very tight electrical tolerances as the screen-printed elements can be laser trimmed to precise values and the completed assembly can functionally adjusted with power applied.

Our capabilities include:

• Design
• Substrate Production Capabilities:
• Integrated Component Types:
  • resistors
  • inductors
• Laser trimming
• Surface mount assembly of hybrid modules
• Electrical and functional testing
• Burn-in